Program

Technical Program

The AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) featuring the 11th International Atomic Layer Etching Workshop (ALE 2024) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching.  Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists. The conference will take place Sunday, August 4-Wednesday, August 7, 2024, at the Messukeskus in Helsinki, Finland.

As in past conferences, the meeting will be preceded (Sunday, August 4) by one day of tutorials and perspectives and a welcome reception. Sessions will take place (Monday-Wednesday, August 5-7) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 700+.

Welcome Reception

A Welcome Reception will be held on Sunday from 6:00 p.m-8:00 p.m. at the Messukeskus Helsinki Expo and Convention Centre, Hall 3 for registered attendees and exhibitors.

Awards: Both ALD and ALE will recognize student achievement with awards for the best student posters and/or talks.
See Awards Page

Opening Remarks: 50 Years of ALD

Dr. Tuomo Suntola

During ALD 2024 we will be celebrating the 50 year anniversary of the groundbreaking work on ALD by Dr. Tuomo Suntola and his coworkers who filed the first patent on Atomic Layer Epitaxy in 1974. Dr. Tuomo Suntola will present the opening remarks of the ALD 2024 conference.

ALD Plenary Speaker

Dr. Ivo J. Raaijmakers, ASM, The Netherlands

Dr. Raaijmakers is currently Corporate Vice President and Executive Advisor of ASM International NV (“ASM”), focusing on innovation management, new technologies and government relations. He started his career in 1982 at the Philips Research Labs in the Netherlands. He moved to the USA in 1988, where he held various positions in semiconductor technology development and R&D management at Philips, Novellus, and Applied Materials. Dr. Raaijmakers joined ASM in 1996 in its ASM America subsidiary and was appointed CTO in 1999, based out of ASM’s headquarter in the Netherlands, a position he held until 2022.

Dr. Raaijmakers has authored over 50 technical publications, has been invited as a speaker to many conferences, and is an inventor on over 175 granted patents. He holds M.Sc. (“Ir”) (1982) and Ph.D. (1988) degrees in Physics from “Eindhoven University of Technology” (the Netherlands), specializing in Plasma Physics and Materials Science.

ALE Plenary Speaker

Eric Liu, TEL Technology Center, America, LLC

Eric Liu earned his bachelor’s and master’s degrees in material science and engineering from Penn State University and Cornell University, respectively. He later completed his Ph.D. in Nanoscale Engineering from SUNY Poly. In 2009, he began his career at TSMC and later joined TEL Technology Center, America, LLC in 2015. Currently, he serves as a process engineer manager specializing in patterning for sub-3nm node applications. His research interests include single and multiple pattering methods, process integration, and the demonstration of Design-Technology-Co-Optimization (DTCO). Eric holds over 20 US patents and actively contributes to publications and presentations.

ALD & ALE Joint Invited Speakers

• Satoshi Hamaguchi (Osaka University, Japan)
• Bala Haran (Applied Materials Inc., USA)

ALD Invited Speakers

• Cheol Ho Choi (Kyungpook National University,  South Korea)
• Mariadriana Creatore (TU Eindhoven, The Netherlands)
• Myung Mo Sung (Hanyang University, South Korea)
• Marianna Kemell (University of Helsinki, Finland)
• Jacques Kools (Encapsulix SAS, USA)
• Han-Bo-Ram Lee (Incheon National University, South Korea)
• Lionel Santinacci (Aix-Marseille University, France)
• Uwe Schröder (Namlab, Germany)
• Tamar Segal-Peretz (Technion Israel Institute of Technology, Israel)
• Yukihiro Shimogaki (Tokyo University, Japan)
• Mikko Söderlund (Beneq, Finland)
• Ralf Tonner-Zech (Wilhelm Ostwald Institut fur Physikalische Chemistry, Leipzig, Germany)
• Dave Towner (Intel Corporation, USA)
• Christian Wenger (IHP-Leibniz-Institut für Innovative Mikroelektronik, Germany)

ALE Invited Speakers

• Keun Hee Bai (Samsung Electronics, South Korea)
• Heeyeop Chae (Sungkyunkwan University, South Korea)
• Thierry Chevolleau (CEA-LETI, France)
• Dimitri Kioussis (Intel Corporation, USA)
• Miyako Matsui (Hitachi, Ltd. Research & Development Group, Japan)
• Nathan Marchack (IBM Research, USA)

Tutorial Speakers

• Stacey Bent (Stanford University, USA), “Area Selective Atomic Layer Deposition: What, What for, and What Next?”
• Robert Clark (TEL, USA), “Thin Film Process Technologies for the Atomic Scale Era”
• Wei-Min Li (LeadMicro, China), “ALD for PV, Current State and Future Prospects”
• Thorsten Lill (Clarycon Nanotechnology Research, Inc., USA)
• Job Soethoudt (IMEC, Belgium), “Sustainable Atomic Layer Processing for Semiconductor Applications”
• Charles Winter (Wayne State University, USA), “Thermal Atomic Layer Deposition of Electropositive Metal and Element Films and Assessment of Inherently Selective Growth on Substrates”